Provide accurate and fast ambient temperature for chips, modules, integrated circuit boards, electronic components, etc. Replace liquid nitrogen as a local heat source to provide rapid cooling. Provide a cold source for testing the electrical performance, reliability, aging, and other aspects of the product. Widely used in processes such as drying, anti-corrosion, cooling, curing, and temperature control in closed chambers; Industries such as electroplating, machinery, medical, chemical, electronic chips, and electronic components.

Temperature range: -75℃~-40℃; By introducing room temperature gases such as dry compressed air, nitrogen, argon, etc. into the equipment, the resulting gas can reach the target low-temperature temperature and be supplied to the components or heat exchangers that need to be tested.

Gas heat exchange system with a pressure resistance of 20 bar; Adopting secondary supercooling technology, the refrigeration is rapid and the maximum temperature is low; The whole machine is installed and the system has been debugged before leaving the factory. Users only need to connect the power supply, gas pipeline, and cooling water pipeline to operate it.

Product features:

1. Rapid cooling and unique high-efficiency heat exchange system design;

2. Self developed PLC control, high-definition touch screen display, equipped with multiple protection functions;

3. Integrated dismantling structure: The equipment is fully debugged and assembled at the manufacturing plant.